DSpace at KISTKIST Conference Paper2017

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dc.contributor.authorKim, SangHyeon-
dc.contributor.authorKim, Seong-Kwang-
dc.contributor.authorShim, Jae-Phil-
dc.contributor.authorGeum, Dae-myeong-
dc.contributor.authorJu, Gunwu-
dc.contributor.authorKim, Han Sung-
dc.contributor.authorKim, Hyung-jun-
dc.contributor.authorLim, Hyeong Rak-
dc.contributor.authorHan, Jae-Hoon-
dc.contributor.authorKang, ChangMo-
dc.contributor.authorLee, Dong Seon-
dc.contributor.authorSong, Jin Dong-
dc.contributor.authorChoi, Won Jun-
dc.contributor.authorLIM, HEE JEONG-
dc.date.accessioned2024-01-19T11:07:06Z-
dc.date.available2024-01-19T11:07:06Z-
dc.date.created2022-02-28-
dc.date.issued2017-10-
dc.identifier.issn2573-5926-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/114605-
dc.languageEnglish-
dc.publisherIEEE-
dc.titleHeterogeneous Integration toward Monolithic 3D Chip-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationIEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)-
dc.citation.titleIEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)-
dc.citation.conferencePlaceUS-
dc.citation.conferencePlaceBurlingame, CA-
dc.citation.conferenceDate2017-10-16-
dc.relation.isPartOf2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S)-
dc.identifier.wosid000463041500072-
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KIST Conference Paper > 2017
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