Heterogeneous Integration toward Monolithic 3D Chip
- Authors
- Kim, SangHyeon; Kim, Seong-Kwang; Shim, Jae-Phil; Geum, Dae-myeong; Ju, Gunwu; Kim, Han Sung; Kim, Hyung-jun; Lim, Hyeong Rak; Han, Jae-Hoon; Kang, ChangMo; Lee, Dong Seon; Song, Jin Dong; Choi, Won Jun; LIM, HEE JEONG
- Issue Date
- 2017-10
- Publisher
- IEEE
- Citation
- IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
- ISSN
- 2573-5926
- URI
- https://pubs.kist.re.kr/handle/201004/114605
- Appears in Collections:
- KIST Conference Paper > 2017
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