Metal-Semiconductor Ohmic and Schottky Contact Interfaces for Stable Li-Metal Electrodes

Authors
Ardhi, Ryanda Enggar AnugrahLiu, GuichengLee, Joong Kee
Issue Date
2021-04-09
Publisher
AMER CHEMICAL SOC
Citation
ACS ENERGY LETTERS, v.6, no.4, pp.1432 - 1442
Abstract
Li-metal is an attractive anode material for next-generation batteries owing to its high capacity and low reduction potential. Unfortunately, it undergoes dendritic growth, which limits its development. Herein, amorphous polymeric carbon-based semiconducting passivation layers are applied to Li-metal electrodes using radiofrequency plasma thermal evaporation to suppress dendrite growth. The plasma power is controlled to adjust the semiconducting type and mechanical properties of the plasma-polymerized carbon layer (PCL). n- and p-type semiconducting PCLs (n- and p-PCLs) form ohmic and Schottky contacts, respectively, with the Li-metal. p-PCL was more effective than n-PCL at suppressing Li-dendrite formation, as the former enhanced the modulus and Li-ion conductivity, inducing Liion deposition below the passivation layer. The p-PCL-coated Li electrode maintains state-of-the-art stable dendrite-free cycling behavior with overpotentials of similar to 11.10 and similar to 79.84 mV over 16 450 and 2472 h at 1 and 10 mA cm(-2), respectively.
Keywords
LITHIUM METAL; ANODE; CONDUCTIVITY; INTERPHASES; DEPOSITION; GRAPHITE; FILM; LITHIUM METAL; ANODE; CONDUCTIVITY; INTERPHASES; DEPOSITION; GRAPHITE; FILM; Metal-Semiconductor; Ohimic and Schottky contact; Interface; Stable; Li-Metal Electrodes
ISSN
2380-8195
URI
https://pubs.kist.re.kr/handle/201004/117141
DOI
10.1021/acsenergylett.1c00150
Appears in Collections:
KIST Article > 2021
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE