Vertically integrated submicron amorphous-In2Ga2ZnO7 thin film transistor using a low temperature process

Authors
Rha, Sang HoJung, JisimJung, Yoon SooChung, Yoon JangKim, Un KiHwang, Eun SukPark, Byoung KeonPark, Tae JooChoi, Jung-HaeHwang, Cheol Seong
Issue Date
2012-05-14
Publisher
AMER INST PHYSICS
Citation
APPLIED PHYSICS LETTERS, v.100, no.20
Abstract
In this work, vertically integrated amorphous-In2Ga2ZnO7 (a-IGZO) thin film transistors (V-TFTs) with 310 nm channel length were fabricated using a low temperature process (<300 degrees C), and their device performance was evaluated. The fabricated V-TFTs show well behaved transfer characteristics with an I-on/I-off current ratio greater than 10(4) and a threshold voltage of 1.7 V. The influence of the vertical structure on device performance was analyzed in detail. In addition, current polarity characteristics that arise from different metal/a-IGZO contacts were also examined. The non-optimum performance of the V-TFTs was attributed to the fringing-field effect, high defect density, and large source/drain contact resistance. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4717621]
ISSN
0003-6951
URI
https://pubs.kist.re.kr/handle/201004/129257
DOI
10.1063/1.4717621
Appears in Collections:
KIST Article > 2012
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