Effects of silica particles on the electrical percolation threshold and thermomechanical properties of epoxy/silver nanocomposites

Authors
Nam, SeungwoongCho, Hyun WooKim, TaehoKim, DaeheumSung, Bong JuneLim, SoonhoKim, Heesuk
Issue Date
2011-07-25
Publisher
AMER INST PHYSICS
Citation
APPLIED PHYSICS LETTERS, v.99, no.4
Abstract
We experimentally and theoretically demonstrated that the addition of silica particles could improve both the electrical conductivity and the thermomechanical properties of epoxy/silver nanocomposites. As silica particles were added, the electrical percolation threshold concentration of silver nanoparticles decreased and the electrical resistivity of the composite decreased by about 8 orders of magnitude. The coefficient of thermal expansion also decreased with increasing volume fraction of silica particles. Molecular simulations showed that the additional silica particles made the effective intermolecular interactions between silver nanoparticles attractive, thereby enhancing the formation of an electrical percolation network. (C) 2011 American Institute of Physics. [doi:10.1063/1.3615690]
Keywords
CONDUCTIVE ADHESIVES; FAILURE MECHANISMS; FLIP-CHIP; RELIABILITY; COMPOSITES; SIZE; RESISTANCE; SOLDER; CONDUCTIVE ADHESIVES; FAILURE MECHANISMS; FLIP-CHIP; RELIABILITY; COMPOSITES; SIZE; RESISTANCE; SOLDER
ISSN
0003-6951
URI
https://pubs.kist.re.kr/handle/201004/130170
DOI
10.1063/1.3615690
Appears in Collections:
KIST Article > 2011
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