Hemocompatibility of surface-modified, silicon-incorporated, diamond-like carbon films

Authors
Roy, R. K.Choi, H. W.Yi, J. W.Moon, M. -W.Lee, K. -R.Han, D. K.Shin, J. H.Kamijo, A.Hasebe, T.
Issue Date
2009-01
Publisher
ELSEVIER SCI LTD
Citation
ACTA BIOMATERIALIA, v.5, no.1, pp.249 - 256
Abstract
The hemocompatibility of plasma-treated, silicon-incorporated, diamond-like carbon (Si-DLC) films was investigated. Si-DLC films with a Si concentration of 2 at.% were prepared on Si (100) or Nitinol substrates using a capacitively coupled radiofrequency plasma-assisted chemical vapor deposition method using a mixed gas of benzene (C6H6) and diluted silane (SiH4:H-2 = 10:90). The Si-DLC films were then treated with O-2, CF4 or N-2 glow discharge for surface modification. The plasma treatment revealed an intimate relationship between the polar component of the surface energy and its hemocompatibility. All in vitro characterizations, i.e. protein absorption behavior, activated partial thromboplastin time measurement and platelet adhesion behavior, showed improved hemocompatibility of the N-2- or O-2-plasma-treated surfaces where the polar component of the surface energy was significantly increased. Si-O or Si-N surface bonds played an important role in improving hemocompatibility, as observed in a model experiment. These results support the importance of a negatively charged polar component of the surface in inhibiting fibrinogen adsorption and platelet adhesion. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Keywords
PROTEIN ADSORPTION; AMORPHOUS-CARBON; DLC COATINGS; PLATELET ACTIVATION; ENERGY; BIOCOMPATIBILITY; THROMBOGENICITY; ATTACHMENT; INTERFACES; FIBRINOGEN; PROTEIN ADSORPTION; AMORPHOUS-CARBON; DLC COATINGS; PLATELET ACTIVATION; ENERGY; BIOCOMPATIBILITY; THROMBOGENICITY; ATTACHMENT; INTERFACES; FIBRINOGEN; Diamond-like carbon; Surface treatment; Hemocompatibility; Polar component; Platelet adhesion
ISSN
1742-7061
URI
https://pubs.kist.re.kr/handle/201004/132847
DOI
10.1016/j.actbio.2008.07.031
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KIST Article > 2009
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