Fabrication of nanoabrasive grinding wheels and their application to grinding silicon wafers

Authors
Kim, T. W.Hyun, S. H.Kim, J.Lee, J. H.Lee, H. W.
Issue Date
2006-08
Publisher
TRANS TECH PUBLICATIONS LTD
Citation
SCIENCE OF ENGINEERING CERAMICS III, v.317-318, pp.373 - 376
Abstract
In the surface machining of brittle materials, there exists a transition from brittle to ductile modes when the depth of cut is reduced below a critical size using ultrafine abrasive grains. Vitrified grinding wheels containing ultrafine abrasives in the sub-micrometer to nanometer range were fabricated by mechanochemically milling nanoabrasive particles and subsequent viscous sintering of abrasive-binder composites. The grinding characteristics of the nanoabrasive grinding wheels were evaluated for the fine grinding of silicon wafers in terms of a variety of variables. Preliminary wafer grinding results are presented on material removal rate and surface quality of silicon wafers.
Keywords
nanoabrasive; mechanochemical mixing; vitrified bond; grinding wheel; surface quality
ISSN
1013-9826
URI
https://pubs.kist.re.kr/handle/201004/135310
DOI
10.4028/www.scientific.net/KEM.317-318.373
Appears in Collections:
KIST Article > 2006
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