Fabrication of nanoabrasive grinding wheels and their application to grinding silicon wafers
- Authors
- Kim, T. W.; Hyun, S. H.; Kim, J.; Lee, J. H.; Lee, H. W.
- Issue Date
- 2006-08
- Publisher
- TRANS TECH PUBLICATIONS LTD
- Citation
- SCIENCE OF ENGINEERING CERAMICS III, v.317-318, pp.373 - 376
- Abstract
- In the surface machining of brittle materials, there exists a transition from brittle to ductile modes when the depth of cut is reduced below a critical size using ultrafine abrasive grains. Vitrified grinding wheels containing ultrafine abrasives in the sub-micrometer to nanometer range were fabricated by mechanochemically milling nanoabrasive particles and subsequent viscous sintering of abrasive-binder composites. The grinding characteristics of the nanoabrasive grinding wheels were evaluated for the fine grinding of silicon wafers in terms of a variety of variables. Preliminary wafer grinding results are presented on material removal rate and surface quality of silicon wafers.
- Keywords
- nanoabrasive; mechanochemical mixing; vitrified bond; grinding wheel; surface quality
- ISSN
- 1013-9826
- URI
- https://pubs.kist.re.kr/handle/201004/135310
- DOI
- 10.4028/www.scientific.net/KEM.317-318.373
- Appears in Collections:
- KIST Article > 2006
- Files in This Item:
There are no files associated with this item.
- Export
- RIS (EndNote)
- XLS (Excel)
- XML
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.