Effect of hydrogen content on characteristics of Cu/C : H films coated on polyethylene terephthalate substrate prepared by ECR-MOCVD coupled with a periodic DC bias

Authors
Lee, Joong KeeJeon, Bup JuLee, Sangwha
Issue Date
2006-03
Publisher
TRANS TECH PUBLICATIONS LTD
Citation
ECO-MATERIALS PROCESSING & DESIGN VII, v.510-511, pp.666 - 669
Abstract
Cu/C:H films were prepared on the PET (polyethylene terephthalate) substrate under room temperature by ECR (electron-cyclotron-resonance) chemical vapor deposition coupled with a (-)DC bias system. Hydrogen contents in the plasma strongly affected the crystallographic structures, sheet resistivity, and the composition of deposited films. Cu (111) peaks by XRD analysis were clearly observed with the increase of hydrogen contents. The surface morphology also indicated that copper grains of very fine crystallites were incorporated in the metal-organic composite films by the introduction of hydrogen gas to the plasma. Cu/C:H composite films exhibited a good adhesion force due to the generation of sp(3)-CH2 bonding. These observations imply that hydrogen induced the formation of stable volatile organic compounds and the reduction of copper, consequently leading to a significant alteration of the crystallographic structure and composition of deposited films. Finally, the EMI shielding efficiency was increased by the addition of hydrogen gas to the plasma, probably due to the increase of copper contents in the film.
Keywords
ECR; DC bias; Cu/C : H film; room temperature CVD; PET; EMI (electromagnetic interference)
ISSN
0255-5476
URI
https://pubs.kist.re.kr/handle/201004/135666
DOI
10.4028/www.scientific.net/MSF.510-511.666
Appears in Collections:
KIST Article > 2006
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