Stress induced crystallization of amorphous materials and mechanical properties of nanocrystalline materials: a molecular dynamics simulation study

Authors
Lee, BJLee, CSLee, JC
Issue Date
2003-12
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Citation
ACTA MATERIALIA, v.51, no.20, pp.6233 - 6240
Abstract
The deformation behavior of amorphous and nanocrystalline pure Ni thin films has been investigated using a molecular dynamics simulation study based on a semi-empirical interatomic potential (MEAM). It was observed that a tensile stress introduced to an amorphous material can enhance crystallization which eventually serves as an important deformation mechanism. After completion of crystallization, grains grow mainly by the rotation and coalescence, and with increasing grain size, the flow stress also increases. It was also found that when the grain size is small (below about 3 nm), the dominant deformation mechanisms are the grain rotation and the grain boundary sliding, the former being more active for smaller grains. The dependence of these observations on the interatomic potential used in the simulation is also discussed. (C) 2003 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Keywords
COMPUTER-SIMULATION; GRAIN-BOUNDARIES; FCC METALS; DEFORMATION; POTENTIALS; SOLIDS; CU; NI; PD; stress induced crystallization; amorphous; nanocrystalline; mechanical property; molecular dynamics
ISSN
1359-6454
URI
https://pubs.kist.re.kr/handle/201004/138011
DOI
10.1016/S1359-6454(03)00446-4
Appears in Collections:
KIST Article > 2003
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