Low-cost production of large RBSC components by plastic forming processes

Abstract

Large-size RBSC components have been successfully fabricated in near-net-dimension by eliminating process shrinkages. Forming shrinkages were substantially decreased to negligible level by thermoset molding, while sintering shrinkage was almost completely eliminated by reaction infiltration. Powder-resin mixture with sufficient fluidity was used to form a radiant tube by powder transfer molding, while homogeneous granules in dry state were used to form a pile with multiple notches for a wafer carrier by powder compression molding. Green joining was employed to fabricate a wafer carrier by applying a rapidly curing paste between two,end plates and four piles with multiple slots. Reaction infiltration was completed using a concept of contact infiltration which established planar contacts between the preform and reservoir with subdued liquid agglomeration.