Effects of residual stress on fracture strength of Si3N4/stainless steel joints with a Cu-interlayer

Authors
Chang, HPark, SWChoi, SCKim, TW
Issue Date
2002-12
Publisher
SPRINGER
Citation
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, v.11, no.6, pp.640 - 644
Abstract
The variation in fracture strength of a brazed Si3N4/Cu/steel joint was compared with the change in residual stress as a function of the Cu-interlayer thickness that was used. The higher residual stress and the lower measured fracture strength for the joint, using a 0.1 mm thick Cu-interlayer, were ascribed to the entire dissolution of the Cu-interlayer into the brazing alloy. The finite element analysis of residual stress, which considered the microstructure at the interface region, could explain the fracture behavior for the brazed joints, which is dependent on the thickness of the Cu-interlayer.
Keywords
METAL; ZIRCONIA; MICROSTRUCTURE; CERAMICS; METAL; ZIRCONIA; MICROSTRUCTURE; CERAMICS; brazing; interlayer; joining; silicon-nitride
ISSN
1059-9495
URI
https://pubs.kist.re.kr/handle/201004/139030
DOI
10.1361/105994902770343638
Appears in Collections:
KIST Article > 2002
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