DSpace at KISTKIST Article2002

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dc.contributor.authorChoi, IS-
dc.contributor.authorPark, YJ-
dc.contributor.authorJoo, YC-
dc.date.accessioned2024-01-21T11:06:37Z-
dc.date.available2024-01-21T11:06:37Z-
dc.date.created2021-09-05-
dc.date.issued2002-02-01-
dc.identifier.issn1359-6462-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/139775-
dc.description.abstractWith different locations of a cluster, stress evolutions at a via are simulated. Via fails fastest at a specific location of a cluster, which is named fastest stress enhancing polygranular cluster position (FaSEPP). Suggested model and simulated results show that FaSEPP decreases with increasing current density but does not vary with temperature. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectCONFINED METAL LINES-
dc.subjectSTRESS EVOLUTION-
dc.subjectINTERCONNECTS-
dc.subjectRELIABILITY-
dc.subjectCONDUCTORS-
dc.titleElectromigration-induced via failure assisted by neighboring clusters-
dc.typeArticle-
dc.identifier.doi10.1016/S1359-6462(01)01235-0-
dc.description.journalClass1-
dc.identifier.bibliographicCitationSCRIPTA MATERIALIA, v.46, no.3, pp.247 - 251-
dc.citation.titleSCRIPTA MATERIALIA-
dc.citation.volume46-
dc.citation.number3-
dc.citation.startPage247-
dc.citation.endPage251-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000175508300012-
dc.identifier.scopusid2-s2.0-0036466892-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.type.docTypeArticle-
dc.subject.keywordPlusCONFINED METAL LINES-
dc.subject.keywordPlusSTRESS EVOLUTION-
dc.subject.keywordPlusINTERCONNECTS-
dc.subject.keywordPlusRELIABILITY-
dc.subject.keywordPlusCONDUCTORS-
dc.subject.keywordAuthorelectromigration-
dc.subject.keywordAuthorcomputer simulatiom-
dc.subject.keywordAuthorinterconnects-
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