DSpace at KISTKIST Article2001

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dc.contributor.author정증현-
dc.contributor.author이소윤-
dc.contributor.author권동일-
dc.contributor.author이욱성-
dc.contributor.author백영준-
dc.date.accessioned2024-01-21T11:45:28Z-
dc.date.available2024-01-21T11:45:28Z-
dc.date.created2022-01-10-
dc.date.issued2001-09-
dc.identifier.issn1738-8228-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/140203-
dc.publisher대한금속.재료학회-
dc.titleMechanical analysis for thermal cracking control in CVD-processed diamond thick films for electronic applications-
dc.title.alternative웨이퍼용 CVD 다이아몬드 후막의 균열발생 제어를 위한 역학적 해석-
dc.typeArticle-
dc.description.journalClass2-
dc.identifier.bibliographicCitation대한금속 . 재료학회지 = Journal of the Korean Institute of Metals and Materials, v.39, no.9, pp.974 - 982-
dc.citation.title대한금속 . 재료학회지 = Journal of the Korean Institute of Metals and Materials-
dc.citation.volume39-
dc.citation.number9-
dc.citation.startPage974-
dc.citation.endPage982-
dc.description.journalRegisteredClasskci-
dc.subject.keywordAuthordiamond thick film-
dc.subject.keywordAuthorcracking-
dc.subject.keywordAuthorfinite element analysis-
dc.subject.keywordAuthorthermal stress-
dc.subject.keywordAuthorinterfacial adhesion-
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KIST Article > 2001
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