Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Cho, J | - |
dc.contributor.author | Han, S | - |
dc.contributor.author | Lee, Y | - |
dc.contributor.author | Kim, OK | - |
dc.contributor.author | Kim, GH | - |
dc.contributor.author | Kim, YW | - |
dc.contributor.author | Lim, H | - |
dc.contributor.author | Jung, HS | - |
dc.date.accessioned | 2024-01-21T12:36:09Z | - |
dc.date.available | 2024-01-21T12:36:09Z | - |
dc.date.created | 2021-09-05 | - |
dc.date.issued | 2001-04 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/140583 | - |
dc.description.abstract | Ultrashallow p(+)/n junctions fabricated by plasma source ion implantation (PSII) were studied. After as-implanted samples were spike-annealed at 1000 degreesC and annealed for 5 sat 1000 degreesC, for samples with a background doping concentration of 6x10(17)#/cm(3), ultrashallow junction depths of 548 Angstrom and 745 Angstrom, respectively, could be obtained with an implant energy of 0.5 keV. Also, sheet resistances of 330 Omega/rectangle and 228 Omega/rectangle were acquired, respectively. These junction depths and sheet resistances obtained by the PSII process were found to satisfy 0.15 mum metal oxide semiconductor field effect transistor (MOSFET) applications. | - |
dc.language | English | - |
dc.publisher | INST PURE APPLIED PHYSICS | - |
dc.subject | TRANSIENT ENHANCED DIFFUSION | - |
dc.subject | SILICON | - |
dc.subject | BORON | - |
dc.title | Plasma source ion implantation for ultrashallow junctions: Low energy and high dose rate | - |
dc.type | Article | - |
dc.identifier.doi | 10.1143/JJAP.40.2506 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.40, no.4A, pp.2506 - 2507 | - |
dc.citation.title | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | - |
dc.citation.volume | 40 | - |
dc.citation.number | 4A | - |
dc.citation.startPage | 2506 | - |
dc.citation.endPage | 2507 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000170771700080 | - |
dc.identifier.scopusid | 2-s2.0-0035302364 | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalResearchArea | Physics | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | TRANSIENT ENHANCED DIFFUSION | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | BORON | - |
dc.subject.keywordAuthor | plasma source ion implantation | - |
dc.subject.keywordAuthor | ultrashallow junction | - |
dc.subject.keywordAuthor | junction depth | - |
dc.subject.keywordAuthor | 0.15 mu m MOSFET | - |
dc.subject.keywordAuthor | background doping concentration | - |
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