Preparation and characterization of organic-inorganic hybrid materials via sol-gel reaction for interlayer dielectrics

Abstract

Polyimides containing hydroxyl group, so-called poly(hydroxy-imide)s, were prepared by the thermal imidization in the presence of m-cresol. The poly(hydroxy-imide)s exhibited high resistance to thermal degradation, with 10% weight loss temperature starring at near 527 degreesC in air. The organic/inorganic hybrid materials were prepared with TEOS by acid-catalyzed sol-gel reaction of sol-gel polyimide precursors obtained from die coupling reaction of the poly(hydroxy-imide) with 3-(triethoxysilyl)propyl isocyanate. All of the cured hybrid films spin-coated on ITO glass are transparent. The initial decomposition temperature was recorded at 356 degreesC. The dielectric constant of a hybrid material Rim was 3.24 at the frequency of 10kHz. The hybrid materials retained the coefficient of thermal expansion up to 3 pDm/degreesC below Tg and 30 ppm/degreesC above Tg.