DSpace at KIST: Vacuum-electrostatic bonding properties of glass-to-glass substrates

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DC Field	Value	Language
dc.contributor.author	주병권	-
dc.contributor.author	이덕중	-
dc.contributor.author	이윤희	-
dc.date.accessioned	2024-01-21T14:10:04Z	-
dc.date.available	2024-01-21T14:10:04Z	-
dc.date.created	2022-01-10	-
dc.date.issued	2000-04	-
dc.identifier.issn	1226-9360	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/141471	-
dc.publisher	한국마이크로전자 및 패키징학회	-
dc.title	Vacuum-electrostatic bonding properties of glass-to-glass substrates	-
dc.title.alternative	유리-유리 기판의 진공-정전 열 접합 특성	-
dc.type	Article	-
dc.description.journalClass	2	-
dc.identifier.bibliographicCitation	마이크로전자 및 패키징학회지 = Journal of Microelectronics and Packaging Society, v.7, no.1, pp.7 - 12	-
dc.citation.title	마이크로전자 및 패키징학회지 = Journal of Microelectronics and Packaging Society	-
dc.citation.volume	7	-
dc.citation.number	1	-
dc.citation.startPage	7	-
dc.citation.endPage	12	-
dc.subject.keywordAuthor	wafer bonding	-

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