Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 주병권 | - |
| dc.contributor.author | 이덕중 | - |
| dc.contributor.author | 이윤희 | - |
| dc.date.accessioned | 2024-01-21T14:10:04Z | - |
| dc.date.available | 2024-01-21T14:10:04Z | - |
| dc.date.created | 2022-01-10 | - |
| dc.date.issued | 2000-04 | - |
| dc.identifier.issn | 1226-9360 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/141471 | - |
| dc.publisher | 한국마이크로전자 및 패키징학회 | - |
| dc.title | Vacuum-electrostatic bonding properties of glass-to-glass substrates | - |
| dc.title.alternative | 유리-유리 기판의 진공-정전 열 접합 특성 | - |
| dc.type | Article | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 마이크로전자 및 패키징학회지 = Journal of Microelectronics and Packaging Society, v.7, no.1, pp.7 - 12 | - |
| dc.citation.title | 마이크로전자 및 패키징학회지 = Journal of Microelectronics and Packaging Society | - |
| dc.citation.volume | 7 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 7 | - |
| dc.citation.endPage | 12 | - |
| dc.subject.keywordAuthor | wafer bonding | - |
- Appears in Collections:
- KIST Article > 2000
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