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Vacuum-electrostatic bonding properties of glass-to-glass substrates

Other Titles

유리-유리 기판의 진공-정전 열 접합 특성

Authors

주병권; 이덕중; 이윤희

Issue Date

2000-04

Publisher

한국마이크로전자 및 패키징학회

Citation

마이크로전자 및 패키징학회지 = Journal of Microelectronics and Packaging Society, v.7, no.1, pp.7 - 12

Keywords

wafer bonding

ISSN

1226-9360

URI

https://pubs.kist.re.kr/handle/201004/141471

Appears in Collections:

KIST Article > 2000

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