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dc.contributor.author주병권-
dc.contributor.author이덕중-
dc.contributor.author최우범-
dc.contributor.author김영조-
dc.contributor.author이남양-
dc.contributor.author오명환-
dc.date.accessioned2024-01-21T15:05:10Z-
dc.date.available2024-01-21T15:05:10Z-
dc.date.created2022-01-10-
dc.date.issued1999-09-
dc.identifier.issn0254-4172-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/141926-
dc.publisher大韓電氣學會-
dc.titleSodalime-sodalime electrostatic bonding using amorphous silicon interlayer and its application to FEA packaging-
dc.title.alternative비정질 실리콘 박막을 이용한 sodalime-sodalime 정전 열 접합 및 FEA packaging 응용-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitation전기학회논문지 = Transactions of the Korean Institute of Electrical Engneers, v.48C, no.9, pp.656 - 661-
dc.citation.title전기학회논문지 = Transactions of the Korean Institute of Electrical Engneers-
dc.citation.volume48C-
dc.citation.number9-
dc.citation.startPage656-
dc.citation.endPage661-
dc.subject.keywordAuthorFED-
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