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Sodalime-sodalime electrostatic bonding using amorphous silicon interlayer and its application to FEA packaging

Other Titles

비정질 실리콘 박막을 이용한 sodalime-sodalime 정전 열 접합 및 FEA packaging 응용

Authors

주병권; 이덕중; 최우범; 김영조; 이남양; 오명환

Issue Date

1999-09

Publisher

大韓電氣學會

Citation

전기학회논문지 = Transactions of the Korean Institute of Electrical Engneers, v.48C, no.9, pp.656 - 661

Keywords

FED

ISSN

0254-4172

URI

https://pubs.kist.re.kr/handle/201004/141926

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KIST Article > Others

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