Low temperature buffer growth to improve hydride vapor phase epitaxy of GaN

Authors
Lee, JWPaek, HSYoo, JBKim, GHKum, DW
Issue Date
1999-05-06
Publisher
ELSEVIER SCIENCE SA
Citation
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.59, no.1-3, pp.12 - 15
Abstract
Two-step growth of hydride vapor phase epitaxy (HVPE) was optimized to grow high-quality, thick GaN film on the (0001) sapphire substrate using ammonia, chlorinated gallium and nitrogen carrier gas. Chlorinated Ga and NH3 were used to grow GaN-buffer layers at a temperature range of 550-650 degrees C for 1 to 7 min. The main growth of approximately 30 mu m thick GaN film was performed at 1125 degrees C for 30 min. Surface roughness after the low temperature buffer growth was measured by atomic force microscopy (AFM), and its effect on thick GaN film was characterized by double crystal X-ray diffractometry (DCXRD) and electron microscopy techniques (SEM and TEM). Direct correlation between AFM roughness (in terms of the RMS value) of the buffer layer surface and crystalline quality of the GaN film was observed. It is suggested that the smooth surface of low temperature grown GaN is critical in obtaining good quality GaN film in HVPE. (C) 1999 Elsevier Science S.A. All rights reserved.
Keywords
SUBSTRATE SURFACE; THICK GAN; PRESSURE; DENSITY; SUBSTRATE SURFACE; THICK GAN; PRESSURE; DENSITY; GaN; GaN-buffer; HVPE; surface roughness
ISSN
0921-5107
URI
https://pubs.kist.re.kr/handle/201004/142194
DOI
10.1016/S0921-5107(98)00404-8
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KIST Article > Others
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