Assessment of dry etching damage in permalloy thin films

Authors
Kim, SDLee, JJLim, SHKim, HJ
Issue Date
1999-04-15
Publisher
AMER INST PHYSICS
Citation
JOURNAL OF APPLIED PHYSICS, v.85, no.8, pp.5992 - 5994
Abstract
Permalloy (Ni81Fe19) thin films are etched by ion beam etching (IBE) or reactive ion etching (RIE), and the variation of magnetic properties with etching time is investigated. Magnetic softness of permalloy thin films deteriorates as etching proceeds, i.e., film thickness decreases. Coercivity begins to increase steeply at a thickness of 0.4 mu m and reaches 16 Oe for IBE and 8 Oe for RIE at 0.09 mu m. Effective magnetization is increased by 0.2 kG with IBE but decreased by 0.7 kG with RIE. From an atomic force microscopy analysis and independent wet etching experiments, the increase of coercivity is proved to be attributed to the increase of surface roughness as a result of etching. Etching-induced defects are also responsible for the increase of coercivity, which is confirmed by a measurement of electrical resistivity and x-ray diffraction analysis. Ion beam etching process appears to affect magnetic properties to a greater extent than reactive ion etching process. (C) 1999 American Institute of Physics. [S0021-8979(99)54608-2].
Keywords
dry etching damage
ISSN
0021-8979
URI
https://pubs.kist.re.kr/handle/201004/142250
DOI
10.1063/1.370014
Appears in Collections:
KIST Article > Others
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE