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dc.contributor.author손용배-
dc.contributor.author김상우-
dc.contributor.author김민호-
dc.date.accessioned2024-01-21T15:43:47Z-
dc.date.available2024-01-21T15:43:47Z-
dc.date.created2022-01-10-
dc.date.issued1999-03-
dc.identifier.issn1226-9360-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/142366-
dc.publisher한국마이크로전자 및 패키징학회-
dc.titleStudy on filler effects of high temperature glass sealant-
dc.title.alternative고온용 유리 봉합재의 filler 첨가효과-
dc.typeArticle-
dc.description.journalClass2-
dc.identifier.bibliographicCitation마이크로전자 및 패키징학회지 = Journal of Microelectronics and Packaging Society, v.6, no.1, pp.51 - 58-
dc.citation.title마이크로전자 및 패키징학회지 = Journal of Microelectronics and Packaging Society-
dc.citation.volume6-
dc.citation.number1-
dc.citation.startPage51-
dc.citation.endPage58-
dc.subject.keywordAuthorSOFC-
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