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dc.contributor.author평재협-
dc.contributor.author이상배-
dc.contributor.author신종덕-
dc.date.accessioned2024-01-21T16:08:37Z-
dc.date.available2024-01-21T16:08:37Z-
dc.date.created2022-01-10-
dc.date.issued1999-01-
dc.identifier.issn1229-6376-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/142555-
dc.publisher대한전자공학회-
dc.titleCharacteristics of a solder-clad FBG temperature sensor-
dc.title.alternative땜납이 용융 부착된 FBG 온도 센서의 특성-
dc.typeArticle-
dc.description.journalClass2-
dc.identifier.bibliographicCitation대한전자공학회논문지 CI = Journal of the Institute of Electronics Engineers of Korea CI, v.36D, pp.45 - 50-
dc.citation.title대한전자공학회논문지 CI = Journal of the Institute of Electronics Engineers of Korea CI-
dc.citation.volume36D-
dc.citation.startPage45-
dc.citation.endPage50-
dc.subject.keywordAuthor광섬유-
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