Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 평재협 | - |
dc.contributor.author | 이상배 | - |
dc.contributor.author | 신종덕 | - |
dc.date.accessioned | 2024-01-21T16:08:37Z | - |
dc.date.available | 2024-01-21T16:08:37Z | - |
dc.date.created | 2022-01-10 | - |
dc.date.issued | 1999-01 | - |
dc.identifier.issn | 1229-6376 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/142555 | - |
dc.publisher | 대한전자공학회 | - |
dc.title | Characteristics of a solder-clad FBG temperature sensor | - |
dc.title.alternative | 땜납이 용융 부착된 FBG 온도 센서의 특성 | - |
dc.type | Article | - |
dc.description.journalClass | 2 | - |
dc.identifier.bibliographicCitation | 대한전자공학회논문지 CI = Journal of the Institute of Electronics Engineers of Korea CI, v.36D, pp.45 - 50 | - |
dc.citation.title | 대한전자공학회논문지 CI = Journal of the Institute of Electronics Engineers of Korea CI | - |
dc.citation.volume | 36D | - |
dc.citation.startPage | 45 | - |
dc.citation.endPage | 50 | - |
dc.subject.keywordAuthor | 광섬유 | - |
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