Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 주병권 | - |
| dc.contributor.author | 오명환 | - |
| dc.date.accessioned | 2024-01-21T16:15:06Z | - |
| dc.date.available | 2024-01-21T16:15:06Z | - |
| dc.date.created | 2022-01-10 | - |
| dc.date.issued | 1998-12 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/142669 | - |
| dc.title | 기판 접합 공정 및 이를 이용한 MEMS/FED Packaging 기술동향 . | - |
| dc.type | Article | - |
| dc.description.journalClass | 3 | - |
| dc.identifier.bibliographicCitation | 전기학회지 = Proceedings of KIEE, v.v. 47, no.no. 12, pp.21 - 29 | - |
| dc.citation.title | 전기학회지 = Proceedings of KIEE | - |
| dc.citation.volume | v. 47 | - |
| dc.citation.number | no. 12 | - |
| dc.citation.startPage | 21 | - |
| dc.citation.endPage | 29 | - |
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