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기판 접합 공정 및 이를 이용한 MEMS/FED Packaging 기술동향 .

Authors

주병권; 오명환

Issue Date

1998-12

Citation

전기학회지 = Proceedings of KIEE, v.v. 47, no.no. 12, pp.21 - 29

URI

https://pubs.kist.re.kr/handle/201004/142669

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KIST Article > Others

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