Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 현도빈 | - |
| dc.date.accessioned | 2024-01-21T17:44:26Z | - |
| dc.date.available | 2024-01-21T17:44:26Z | - |
| dc.date.created | 2022-01-10 | - |
| dc.date.issued | 1997-12 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/143478 | - |
| dc.title | Development of thermoelectric cooling module | - |
| dc.title.alternative | IC package용 cooling module 개발 | - |
| dc.type | Article | - |
| dc.description.journalClass | 3 | - |
| dc.identifier.bibliographicCitation | 대한금속학회회보 = Bulletin of the Korean Inst. of Met. & Mat., v.10, no.6, pp.667 - 675 | - |
| dc.citation.title | 대한금속학회회보 = Bulletin of the Korean Inst. of Met. & Mat. | - |
| dc.citation.volume | 10 | - |
| dc.citation.number | 6 | - |
| dc.citation.startPage | 667 | - |
| dc.citation.endPage | 675 | - |
| dc.subject.keywordAuthor | Thermoelectrics | - |
| dc.subject.keywordAuthor | Thermoelectric cooling module | - |
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