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dc.contributor.author김용태-
dc.contributor.author김동준-
dc.contributor.author이창우-
dc.contributor.author박종완-
dc.date.accessioned2024-01-21T18:02:40Z-
dc.date.available2024-01-21T18:02:40Z-
dc.date.created2022-01-10-
dc.date.issued1997-10-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/143561-
dc.titleThermal stabilities of PECVD W-B-N thin films as a diffusion barrier.-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitationMultilevel interconnect technology (SPIE)., v.v. 3214, pp.48 - 56-
dc.citation.titleMultilevel interconnect technology (SPIE).-
dc.citation.volumev. 3214-
dc.citation.startPage48-
dc.citation.endPage56-
dc.subject.keywordAuthorthermal stability-
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