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dc.contributor.author최성창-
dc.contributor.author최원국-
dc.contributor.author고석근-
dc.contributor.author석진우-
dc.contributor.author손용배-
dc.contributor.author정형진-
dc.contributor.author조준식-
dc.date.accessioned2024-01-21T18:15:06Z-
dc.date.available2024-01-21T18:15:06Z-
dc.date.created2021-09-13-
dc.date.issued1997-06-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/143770-
dc.titleEnhancement of adhesion between Cu thin film and polyimide modified by ion assisted reaction-
dc.title.alternative이온 보조 반응법에 의하여 표면처리된 Polyimide (PI) 표면과 구리박막의 접착력 향상-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitationJournal of ISHM, v.4, no.1, pp.19 - 30-
dc.citation.titleJournal of ISHM-
dc.citation.volume4-
dc.citation.number1-
dc.citation.startPage19-
dc.citation.endPage30-
dc.description.isOpenAccessN-
dc.subject.keywordAuthorion assisted reaction-
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