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dc.contributor.author주병권-
dc.contributor.author고창기-
dc.contributor.author이윤희-
dc.contributor.author강인병-
dc.contributor.authorPaul White-
dc.contributor.authorNoel Samaan-
dc.contributor.authorMalcolm Haskard-
dc.contributor.author오명환-
dc.date.accessioned2024-01-21T18:37:29Z-
dc.date.available2024-01-21T18:37:29Z-
dc.date.created2022-01-10-
dc.date.issued1997-03-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/143919-
dc.titleA study on low-temperature bonding of glass-silicon using modified direct bonding method-
dc.title.alternative수정된 직접 접합 방법을 이용한 유리-실리콘 기판의 저온 접합에 관한 연구-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitation전기학회논문지, v.46, no.3, pp.450 - 455-
dc.citation.title전기학회논문지-
dc.citation.volume46-
dc.citation.number3-
dc.citation.startPage450-
dc.citation.endPage455-
dc.subject.keywordAuthorMEMS-
dc.subject.keywordAuthorwafer bonding-
dc.subject.keywordAuthorglass-Si direct bonding-
dc.subject.keywordAuthorNew and low-temperature bonding method-
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