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dc.contributor.authorLee, KH-
dc.contributor.authorJhon, YM-
dc.contributor.authorCha, HJ-
dc.contributor.authorJang, J-
dc.date.accessioned2024-01-21T19:34:57Z-
dc.date.available2024-01-21T19:34:57Z-
dc.date.created2022-01-10-
dc.date.issued1996-06-
dc.identifier.issn0741-3106-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/144432-
dc.description.abstractThe authors have fabricated a new low temperature polycrystalline silicon (poly-Si) thin film transistor (TFT) with silicon nitride (SiNx) ion-stopper and laser annealed poly-Si, The fabricated poly-Si TFT using SiNx as the ion-stopper as well as the gate insulator exhibited a held effect mobility of 110 cm(2)/Vs, threshold voltage of 3.5 V, subthreshold slope of 0.48 V/dec., and on/off current ratio of similar to 10(6). Low off-state leakage current of 2.4 x 10(-12) A/mu m at the drain voltage of 5 V and gate voltage of -5 V was achieved.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleLow temperature polycrystalline line silicon thin film transistor with silicon nitride ion stopper-
dc.typeArticle-
dc.description.journalClass1-
dc.identifier.bibliographicCitationIEEE ELECTRON DEVICE LETTERS, v.17, no.6, pp.258 - 260-
dc.citation.titleIEEE ELECTRON DEVICE LETTERS-
dc.citation.volume17-
dc.citation.number6-
dc.citation.startPage258-
dc.citation.endPage260-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosidA1996UN18300002-
dc.identifier.scopusid2-s2.0-0030166754-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalResearchAreaEngineering-
dc.type.docTypeArticle-
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