Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chae, HB | - |
dc.contributor.author | Park, KH | - |
dc.contributor.author | Seong, DJ | - |
dc.contributor.author | Kim, JC | - |
dc.contributor.author | Baik, YJ | - |
dc.date.accessioned | 2024-01-21T19:36:53Z | - |
dc.date.available | 2024-01-21T19:36:53Z | - |
dc.date.created | 2021-09-05 | - |
dc.date.issued | 1996-05 | - |
dc.identifier.issn | 0195-928X | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/144464 | - |
dc.description.abstract | Diamond films 60 and 170 mu m in thickness were grown by PACVD (plasma-assisted chemical vapor deposition) under similar conditions. The thermal diffusivity of these freestanding films was measured between 100 and 800 K using AC calorimetry. Radiation heat loss from the surface was estimated by analyzing both the amplitude and the phase shift of a lock-in amplifier signal. Thermal conductivity was calculated using the specific heat data of natural diamond. At room temperature, the thermal conductivity of the 60 and 170 mu m films is 9 and 16 W . cm(-1). K-1 respectively, which is 40-70% that of natural diamond. The temperature dependence of thermal conductivity of the CVD diamond films is similar to that of natural diamond. Phonon scattering processes are considered using the Debye model. The microsite of the grain boundary has a significant effect on the mean free path of phonons at low temperatures. The grain in CVD diamond film is grown as a columnar structure. Thus, the thicker film has the larger mean grain size and the higher thermal conductivity. Scanning electron microscopy (SEM) and Raman spectroscopy were used to study the microstructure of the CVD diamond films. In this experiment, we evaluated the quality of CVD diamond film of the whole sample by measuring the thermal conductivity. | - |
dc.language | English | - |
dc.publisher | PLENUM PUBL CORP | - |
dc.title | Thermal conductivity of CVD diamond films | - |
dc.type | Article | - |
dc.identifier.doi | 10.1007/BF01441515 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | INTERNATIONAL JOURNAL OF THERMOPHYSICS, v.17, no.3, pp.695 - 703 | - |
dc.citation.title | INTERNATIONAL JOURNAL OF THERMOPHYSICS | - |
dc.citation.volume | 17 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 695 | - |
dc.citation.endPage | 703 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | A1996UH49600015 | - |
dc.identifier.scopusid | 2-s2.0-0030150157 | - |
dc.relation.journalWebOfScienceCategory | Thermodynamics | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Mechanics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalResearchArea | Thermodynamics | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Mechanics | - |
dc.relation.journalResearchArea | Physics | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | AC calorimetry | - |
dc.subject.keywordAuthor | CVD diamond film | - |
dc.subject.keywordAuthor | Debye phonon model | - |
dc.subject.keywordAuthor | grain boundary | - |
dc.subject.keywordAuthor | thermal conductivity | - |
dc.subject.keywordAuthor | thermal diffusivity | - |
dc.subject.keywordAuthor | U-process | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.