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dc.contributor.author문제도-
dc.contributor.author오재열-
dc.contributor.author조영래-
dc.contributor.author정효수-
dc.contributor.author주병권-
dc.contributor.author오명환-
dc.date.accessioned2024-01-21T20:05:09Z-
dc.date.available2024-01-21T20:05:09Z-
dc.date.created2022-01-10-
dc.date.issued1996-01-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/144713-
dc.titleDesign of electrostatic bonding equipment for large area and the effect of contamination particle on the Si-glass electrostatic bonding.-
dc.title.alternative대면적 정전 접합 장치 고안 및 Si과 glass접합에 미치는 불순물의 영향-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitation한국재료학회지 = Korean journal of materials research, v.6, no.1, pp.3 - 11-
dc.citation.title한국재료학회지 = Korean journal of materials research-
dc.citation.volume6-
dc.citation.number1-
dc.citation.startPage3-
dc.citation.endPage11-
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