DSpace at KIST: Copper film growth by chemical vapor deposition.

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DC Field	Value	Language
dc.contributor.author	윤경렬	-
dc.contributor.author	최두진	-
dc.contributor.author	김석	-
dc.contributor.author	김기환	-
dc.contributor.author	고석근	-
dc.date.accessioned	2024-01-21T20:06:08Z	-
dc.date.available	2024-01-21T20:06:08Z	-
dc.date.created	2022-01-10	-
dc.date.issued	1996-01	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/144730	-
dc.title	Copper film growth by chemical vapor deposition.	-
dc.title.alternative	ICB seeding 에 의한 CVD Cu 박막의 증착 및 특성 분석 =	-
dc.type	Article	-
dc.description.journalClass	3	-
dc.identifier.bibliographicCitation	한국재료학회지 = Korean journal of materials research, v.v. 6, no.no. 7, pp.723 - ?	-
dc.citation.title	한국재료학회지 = Korean journal of materials research	-
dc.citation.volume	v. 6	-
dc.citation.number	no. 7	-
dc.citation.startPage	723	-
dc.citation.endPage	?	-

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