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dc.contributor.author고석근-
dc.contributor.author윤영수-
dc.contributor.author정형진-
dc.contributor.author김기환-
dc.contributor.author이지현-
dc.date.accessioned2024-01-21T20:09:38Z-
dc.date.available2024-01-21T20:09:38Z-
dc.date.created2022-01-10-
dc.date.issued1996-01-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/144790-
dc.titleRoom temperature growth of Cu thin film by nozzle-type partially ionized beam deposition with various acceleration voltages.-
dc.typeArticle-
dc.description.journalClass3-
dc.identifier.bibliographicCitationThin solid films, v.v. 278, pp.45 - 48-
dc.citation.titleThin solid films-
dc.citation.volumev. 278-
dc.citation.startPage45-
dc.citation.endPage48-
dc.subject.keywordAuthordeposition process-
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