Chemical shifts and optical properties of tin oxide films grown by a reactive ion assisted deposition

Authors
Choi, W.-K.Jung, H.-J.Koh, S.-K.
Issue Date
1996-01
Publisher
American Institute of Physics Inc.
Citation
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, v.14, no.2, pp.359 - 366
Abstract
Highly oriented nonstoichiometric tin oxide thin films were grown by a reactive ion assisted deposition onto Si(100) and glass substrates at room temperature as a function of relative ion (O)/atom (Sn metal) arrival ratio, and concurrently the deposited ion energy per atom (eV/atom) were changed from 10 to 100 eV/atom. As-deposited tin oxide films show preferred orientation along the SnO2〈101〉 axis and the x-ray diffraction peak intensity appears maximum at an average energy of about 50 eV/atom. From quantitative Auger electron spectroscopy, characteristic transitional Auger peaks of Sn metal MNN transitions were shifted to lower kinetic energies by 4-6±1.0 eV as the Sn4+ component becomes dominant in the deposited tin oxide films and the position of O KL1,2L2,3 transition line was also shifted to lower kinetic energy by 1-2±1.0 eV as the composition of deposited tin oxide films were changed from SnO to SnO2, respectively. On the basis of a tin 3d core level and O 1s spectra analysis by x-ray photoelectron spectroscopy, the sizable chemical shift of different valencies between stannous tin (Sn2+: SnO) and stannic tin (Sn4+:SnO2) was 1.0±0.02 eV and that of O 1s was 0.87±0.02 eV, and those values show larger shifts than previously reported ones. The refractive index n of as-deposited tin oxide films was evaluated from an ellipsometer, and spectrophotometric transmittances were measured in the wavelength range of 200-800 nm. In the luminous range, the refractive index varied from n=2.36 to 2.04 as oxygen contents increased. ? 1996 American Vacuum Society.
Keywords
Auger electron spectroscopy; Crystal orientation; Deposition; Electron energy levels; Electron transitions; Glass; Refractive index; Semiconducting tin compounds; Silicon wafers; Thin films; X ray diffraction; X ray photoelectron spectroscopy; Auger peaks; Chemical shift; Kinetic energy; Reactive ion assisted deposition; Tin oxide films; Film growth; Auger electron spectroscopy; Crystal orientation; Deposition; Electron energy levels; Electron transitions; Glass; Refractive index; Semiconducting tin compounds; Silicon wafers; Thin films; X ray diffraction; X ray photoelectron spectroscopy; Auger peaks; Chemical shift; Kinetic energy; Reactive ion assisted deposition; Tin oxide films; Film growth; tin oxide film
ISSN
0734-2101
URI
https://pubs.kist.re.kr/handle/201004/144867
DOI
10.1116/1.579901
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