Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 주병권 | - |
dc.contributor.author | 방준호 | - |
dc.contributor.author | 이윤희 | - |
dc.contributor.author | 박종완 | - |
dc.contributor.author | 차균현 | - |
dc.contributor.author | 오명환 | - |
dc.date.accessioned | 2024-01-21T21:39:27Z | - |
dc.date.available | 2024-01-21T21:39:27Z | - |
dc.date.created | 2022-01-10 | - |
dc.date.issued | 1994-04 | - |
dc.identifier.issn | 1225-0562 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/145613 | - |
dc.title | Study on the bonding interface in directly-bonded Si-Si and Si-SiO2/Si wafer pairs | - |
dc.title.alternative | 직접 접합된 Si-Si, Si-SiO2/Si 기판쌍의 접합 계면에 관한 연구 | - |
dc.type | Article | - |
dc.description.journalClass | 2 | - |
dc.identifier.bibliographicCitation | 한국재료학회지 = Korean Journal of Materials Research, v.4, no.2, pp.127 - 135 | - |
dc.citation.title | 한국재료학회지 = Korean Journal of Materials Research | - |
dc.citation.volume | 4 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 127 | - |
dc.citation.endPage | 135 | - |
dc.subject.keywordAuthor | micromachining | - |
dc.subject.keywordAuthor | wafer bonding | - |
dc.subject.keywordAuthor | bonding interface | - |
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