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dc.contributor.author주병권-
dc.contributor.author방준호-
dc.contributor.author이윤희-
dc.contributor.author박종완-
dc.contributor.author차균현-
dc.contributor.author오명환-
dc.date.accessioned2024-01-21T21:39:27Z-
dc.date.available2024-01-21T21:39:27Z-
dc.date.created2022-01-10-
dc.date.issued1994-04-
dc.identifier.issn1225-0562-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/145613-
dc.titleStudy on the bonding interface in directly-bonded Si-Si and Si-SiO2/Si wafer pairs-
dc.title.alternative직접 접합된 Si-Si, Si-SiO2/Si 기판쌍의 접합 계면에 관한 연구-
dc.typeArticle-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국재료학회지 = Korean Journal of Materials Research, v.4, no.2, pp.127 - 135-
dc.citation.title한국재료학회지 = Korean Journal of Materials Research-
dc.citation.volume4-
dc.citation.number2-
dc.citation.startPage127-
dc.citation.endPage135-
dc.subject.keywordAuthormicromachining-
dc.subject.keywordAuthorwafer bonding-
dc.subject.keywordAuthorbonding interface-
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