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dc.contributor.authorKIM, TW-
dc.contributor.authorJUNG, M-
dc.contributor.authorKIM, HJ-
dc.contributor.authorPARK, TH-
dc.contributor.authorYOON, YS-
dc.contributor.authorKANG, WN-
dc.contributor.authorYOM, SS-
dc.contributor.authorNA, HK-
dc.date.accessioned2024-01-21T21:39:40Z-
dc.date.available2024-01-21T21:39:40Z-
dc.date.created2021-09-02-
dc.date.issued1994-03-14-
dc.identifier.issn0003-6951-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/145616-
dc.description.abstractMetalorganic chemical vapor deposition of titanium dioxide (TiO2) on p-Si(100) using titanium isopropoxide and nitrous oxide via pyrolysis at relatively low (approximately 500-degrees-C) temperature was performed to produce high quality TiO2/p-Si interfaces and to fabricate TiO2 insulator gates with a dielectric constant of high magnitude. Scanning electron microscopy shows that the surfaces of the TiO2 films have very smooth morphologies. From the x-ray diffraction analysis, the grown layer was found to be a polycrystalline film. Raman spectroscopy showed the optical phonon modes of a TiO2 thin film. The stoichiometry of the TiO2 film was investigated by Auger electron spectroscopy. Room-temperature current-voltage and capacitance-voltage measurements clearly revealed metal-insulator-semiconductor behavior for the samples of the Ag/TiO2/p-Si. The interface state density at the TiO2/p-Si interface was approximately high 10(11) eV-1 cm-2 at the middle of the Si energy gap, and the dielectric constant determined from the capacitance-voltage measurements was as large as 73. These results indicate the TiO2 layers grown at relatively low temperature can be used for high density dynamic memory.-
dc.languageEnglish-
dc.publisherAMER INST PHYSICS-
dc.subjectTA2O5 FILMS-
dc.subjectTHIN-FILMS-
dc.subjectSILICON-
dc.subjectINP-
dc.titleOPTICAL AND ELECTRICAL-PROPERTIES OF TITANIUM-DIOXIDE FILMS WITH A HIGH MAGNITUDE DIELECTRIC-CONSTANT GROWN ON P-SI BY METALORGANIC CHEMICAL-VAPOR-DEPOSITION AT LOW-TEMPERATURE-
dc.typeArticle-
dc.identifier.doi10.1063/1.111898-
dc.description.journalClass1-
dc.identifier.bibliographicCitationAPPLIED PHYSICS LETTERS, v.64, no.11, pp.1407 - 1409-
dc.citation.titleAPPLIED PHYSICS LETTERS-
dc.citation.volume64-
dc.citation.number11-
dc.citation.startPage1407-
dc.citation.endPage1409-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosidA1994NA49600032-
dc.identifier.scopusid2-s2.0-0028387893-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalResearchAreaPhysics-
dc.type.docTypeArticle-
dc.subject.keywordPlusTA2O5 FILMS-
dc.subject.keywordPlusTHIN-FILMS-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusINP-
dc.subject.keywordAuthorthin films-
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