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dc.contributor.authorAhn, K.-D.-
dc.contributor.authorKang, J.-H.-
dc.contributor.authorKim, S.-J.-
dc.contributor.authorPark, B.-S.-
dc.contributor.authorPark, C.-E.-
dc.contributor.authorPark, C.-G.-
dc.date.accessioned2024-01-21T23:38:33Z-
dc.date.available2024-01-21T23:38:33Z-
dc.date.created2021-09-02-
dc.date.issued1992-01-
dc.identifier.issn0914-9244-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/146699-
dc.description.abstractt-BOC protected hexakis(4-t-BOC-phenoxy)cyclotriphosphazene, TBP, was synthesized from a semiinorganic phosphazene compound and its acid-catalyzed thermal deprotection was utilized in the design of a three-component positive resist system based on the combined principles of chemical amplification and dissolution inhibition. The new resist system, PTPNS(NR/TBP/PAG), is formulated with novolac resin (NR), TBP and a photoacid generator (PAG). The dissolution characteristics of PTPNS in alkaline development are ideally suited for application to positive type resists which are based on a dissolution inhibition mechanism. The t-BOC protected TBP of the PTPNS resist system effectively acts as an acid-labile dissolution inhibitor of novolac resin when TBP concentration is more than 10 % by weight. As a representative, PTPNS(100/15/5) (by weight parts) exhibited high sensitivity in the range of 20 to 25 mJ/cm2 with contrast of 5 after exposure at 250nm light and PEB treatment at 100 to 130°C. Appropriately formulated PTPNS resist rendered positive-tone patterns down to sub-half micron with high sensitivity when the resist was exposed to KrF excimer laser or electron beam and developed with 2.38 wt% tetramethylamonium hydroxide solution. ? 1992, The Society of Photopolymer Science and Technology(SPST). All rights reserved.-
dc.languageEnglish-
dc.titleA new chemical amplification resist system based on novolac and t-BOC protected phosphazene as a dissolution inhibitor-
dc.typeArticle-
dc.identifier.doi10.2494/photopolymer.5.67-
dc.description.journalClass1-
dc.identifier.bibliographicCitationJournal of Photopolymer Science and Technology, v.5, no.1, pp.67 - 77-
dc.citation.titleJournal of Photopolymer Science and Technology-
dc.citation.volume5-
dc.citation.number1-
dc.citation.startPage67-
dc.citation.endPage77-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.identifier.scopusid2-s2.0-0012529074-
dc.type.docTypeArticle-
dc.subject.keywordAuthorthree component positive resist materials-
dc.subject.keywordAuthordeep UV resists-
dc.subject.keywordAuthordry etch resistance-
dc.subject.keywordAuthorchemical amplification resists-
dc.subject.keywordAuthordissolution inhibition resist-
dc.subject.keywordAuthort-BOC protected phosphazene-
dc.subject.keywordAuthornovolac resin-
dc.subject.keywordAuthorphotosensitivity-
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