Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Ahn, K.-D. | - |
dc.contributor.author | Kang, J.-H. | - |
dc.contributor.author | Kim, S.-J. | - |
dc.contributor.author | Park, B.-S. | - |
dc.contributor.author | Park, C.-E. | - |
dc.contributor.author | Park, C.-G. | - |
dc.date.accessioned | 2024-01-21T23:38:33Z | - |
dc.date.available | 2024-01-21T23:38:33Z | - |
dc.date.created | 2021-09-02 | - |
dc.date.issued | 1992-01 | - |
dc.identifier.issn | 0914-9244 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/146699 | - |
dc.description.abstract | t-BOC protected hexakis(4-t-BOC-phenoxy)cyclotriphosphazene, TBP, was synthesized from a semiinorganic phosphazene compound and its acid-catalyzed thermal deprotection was utilized in the design of a three-component positive resist system based on the combined principles of chemical amplification and dissolution inhibition. The new resist system, PTPNS(NR/TBP/PAG), is formulated with novolac resin (NR), TBP and a photoacid generator (PAG). The dissolution characteristics of PTPNS in alkaline development are ideally suited for application to positive type resists which are based on a dissolution inhibition mechanism. The t-BOC protected TBP of the PTPNS resist system effectively acts as an acid-labile dissolution inhibitor of novolac resin when TBP concentration is more than 10 % by weight. As a representative, PTPNS(100/15/5) (by weight parts) exhibited high sensitivity in the range of 20 to 25 mJ/cm2 with contrast of 5 after exposure at 250nm light and PEB treatment at 100 to 130°C. Appropriately formulated PTPNS resist rendered positive-tone patterns down to sub-half micron with high sensitivity when the resist was exposed to KrF excimer laser or electron beam and developed with 2.38 wt% tetramethylamonium hydroxide solution. ? 1992, The Society of Photopolymer Science and Technology(SPST). All rights reserved. | - |
dc.language | English | - |
dc.title | A new chemical amplification resist system based on novolac and t-BOC protected phosphazene as a dissolution inhibitor | - |
dc.type | Article | - |
dc.identifier.doi | 10.2494/photopolymer.5.67 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | Journal of Photopolymer Science and Technology, v.5, no.1, pp.67 - 77 | - |
dc.citation.title | Journal of Photopolymer Science and Technology | - |
dc.citation.volume | 5 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 67 | - |
dc.citation.endPage | 77 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.scopusid | 2-s2.0-0012529074 | - |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | three component positive resist materials | - |
dc.subject.keywordAuthor | deep UV resists | - |
dc.subject.keywordAuthor | dry etch resistance | - |
dc.subject.keywordAuthor | chemical amplification resists | - |
dc.subject.keywordAuthor | dissolution inhibition resist | - |
dc.subject.keywordAuthor | t-BOC protected phosphazene | - |
dc.subject.keywordAuthor | novolac resin | - |
dc.subject.keywordAuthor | photosensitivity | - |
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