Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 백승협 | - |
dc.contributor.author | 김민석 | - |
dc.contributor.author | 장지수 | - |
dc.contributor.author | 허성훈 | - |
dc.contributor.author | 강종윤 | - |
dc.contributor.author | 송현철 | - |
dc.contributor.author | 김성근 | - |
dc.contributor.author | 최지원 | - |
dc.contributor.author | 김진상 | - |
dc.contributor.author | 윤정호 | - |
dc.date.accessioned | 2025-04-25T21:30:08Z | - |
dc.date.available | 2025-04-25T21:30:08Z | - |
dc.date.issued | 2025-04-04 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/152357 | - |
dc.title | 이종 접합 반도체 유연기판, 그의 제조방법 및 그를 이용한 전자소자 | - |
dc.type | Patent | - |
dc.date.registration | 2025-04-04 | - |
dc.date.application | 2022-11-29 | - |
dc.identifier.patentRegistrationNumber | 10-2793509 | - |
dc.identifier.patentApplicationNumber | 10-2022-0162246 | - |
dc.publisher.country | KO | - |
dc.type.iprs | 특허 | - |
dc.contributor.assignee | 한국과학기술연구원 | - |
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