Full metadata record

DC Field Value Language
dc.contributor.author백승협-
dc.contributor.author김민석-
dc.contributor.author장지수-
dc.contributor.author허성훈-
dc.contributor.author강종윤-
dc.contributor.author송현철-
dc.contributor.author김성근-
dc.contributor.author최지원-
dc.contributor.author김진상-
dc.contributor.author윤정호-
dc.date.accessioned2025-04-25T21:30:08Z-
dc.date.available2025-04-25T21:30:08Z-
dc.date.issued2025-04-04-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/152357-
dc.title이종 접합 반도체 유연기판, 그의 제조방법 및 그를 이용한 전자소자-
dc.typePatent-
dc.date.registration2025-04-04-
dc.date.application2022-11-29-
dc.identifier.patentRegistrationNumber10-2793509-
dc.identifier.patentApplicationNumber10-2022-0162246-
dc.publisher.countryKO-
dc.type.iprs특허-
dc.contributor.assignee한국과학기술연구원-
Appears in Collections:
KIST Patent > 2022
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE