Showing results 1 to 4 of 4
Issue Date | Title | Author(s) |
---|---|---|
1995-01 | New concept for amorphous diffusion barrier: Ion beam modification of metal/semiconductor interface. | Kim Yong Tae; S. K. Kwak; C. S. Kwon; D. J. Kim; C. W. Lee; I. H. Choi; Min Suk-Ki |
1996-01 | Nitrogen effects of Ta-Si-N diffusion barrier in Si/Cu metallization. | Kim Yong Tae; S. P. Jeong; D. J. Kim; J. W. Park; Min Suk-Ki |
1994-01 | Nitrogen implanted tungsten thin films for Cu diffusion barrier. | Kim Yong Tae; D. J. Kim; C. S. Kwon; I. H. Choi; Min Suk-Ki |
1996-01 | Study of temperature dependent conductivity of Ta, Ta-Si-N thin films. | Kim Yong Tae; S. P. Jeong; D. J. Kim; H. N. Lee; Min Suk-Ki |