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Results 1-10 of 31 (Search time: 0.003 seconds).
Item hits:
Issue Date
Title
Author(s)
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A novel wafer level packaging of the RF-MEMS devices with low loss
박윤권
;
이덕중
;
박흥우
;
송인상
;
김정우
;
SONG CI MOO
;
LEE YUN HI
;
김철주
;
Ju Byeong Kwon
-
Wafer level sealing technology of MEMS devices using B-stage epoxy
박흥우
;
박윤권
;
이덕중
;
김철주
;
PARK JEONG HO
;
서용교
;
김정우
;
SONG CI MOO
;
OH MYUNG HWAN
;
Ju Byeong Kwon
-
(Undefined)
Ju Byeong Kwon
;
박흥우
;
이덕중
;
서상원
;
김남수
;
PARK JEONG HO
;
OH MYUNG HWAN
-
Packaging of the RF-MEMS switch
박흥우
;
이덕중
;
박윤권
;
김철주
;
PARK JEONG HO
;
서용교
;
김정우
;
SONG CI MOO
;
OH MYUNG HWAN
;
Ju Byeong Kwon
-
Surface-micromachined vacuum magnetic field sensors
Ju Byeong Kwon
;
박흥우
;
이덕중
;
PARK JEONG HO
;
OH MYUNG HWAN
-
Vacuum packaging and operating properties of micro-tunneling sensors
Ju Byeong Kwon
;
박흥우
;
이덕중
;
SON YONG BAE
;
PARK JEONG HO
;
OH MYUNG HWAN
-
Thin PDP packaging by glass-bonding techonlogy and its driving properties
이덕중
;
Ju Byeong Kwon
;
정진욱
;
박흥우
;
LEE YUN HI
;
김영조
;
조태성
;
최은하
;
장진
;
OH MYUNG HWAN
-
(Undefined)
Ju Byeong Kwon
;
박흥우
;
이덕중
;
PARK JEONG HO
;
OH MYUNG HWAN
-
Electrostatically vacuum sealed tunneling magnetic sensors
박흥우
;
Ju Byeong Kwon
;
이덕중
;
PARK JEONG HO
;
OH MYUNG HWAN
-
Packaging of the vacuum magnetic field sensors
박흥우
;
이덕중
;
PARK JEONG HO
;
OH MYUNG HWAN
;
Ju Byeong Kwon
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Discover
-Author
30
OH MYUNG HWAN
18
PARK JEONG HO
15
김철주
11
박윤권
10
이덕중
7
Jung Jae Hoon
6
SUH SANG HEE
5
LEE YUN HI
5
Sang-Seop Yom
4
Kim Sung Jin
next >
-Subject
13
MEMS
3
FEA
3
FED
2
flip-chip
1
bump
1
cantilver
1
direct bonding
1
electrostatically vacuum seal
1
field emission
1
field emission theory
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