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Liquid Crystalline Epoxy Resin/Alumina Composites for Highly Thermal Conducting Circuit Board

Authors

Kim youngsu; Kim Chae Bin; Lee Seung-Hee; Goh Munju

Publisher

11.8~10, 부산

Citation

한국공업화학회 2017 추계 학술대회

Keywords

액정성에폭시; 합성; 열전도도; 복합재료

URI

https://pubs.kist.re.kr/handle/201004/87615

Appears in Collections:

KIST Conference Paper > Others

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