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계면접착력이 우수한 Cu-질화물 회로기판

Author

변지영; 김상훈; 최광덕

Assignee

한국과학기술연구원

Regitration Date

2021-06-30

Registration No.

10-2273696

Application Date

2019-11-29

Application No.

10-2019-0157456

Country

KO

URI

https://pubs.kist.re.kr/handle/201004/88551

Appears in Collections:

KIST Patent > 2019

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