이종 접합 반도체 기판, 그의 제조방법 및 그를 이용한 전자소자

Author
백승협영서광한재훈이병철김진상송현철김성근강종윤최지원윤정호
Assignee
한국과학기술연구원
Regitration Date
2023-10-12
Registration No.
10-2590568
Application Date
2021-07-06
Application No.
10-2021-0088485
Country
KO
URI
https://pubs.kist.re.kr/handle/201004/91400
Appears in Collections:
KIST Patent > 2021
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