DSpace at KIST: Low stress C doped WN diffusion barrier for Cu interconnection

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DC Field	Value	Language
dc.contributor.author	Kim, Yong Tae	-
dc.contributor.author	Kim, Young-Hwan	-
dc.date.accessioned	2024-01-12T17:35:46Z	-
dc.date.available	2024-01-12T17:35:46Z	-
dc.date.created	2021-09-29	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/92861	-
dc.language	English	-
dc.subject	Cu diffusion barrier	-
dc.subject	C doped WN	-
dc.subject	ALD	-
dc.subject	Cu interconnection	-
dc.title	Low stress C doped WN diffusion barrier for Cu interconnection	-
dc.type	Conference	-
dc.description.journalClass	1	-
dc.identifier.bibliographicCitation	International Conference on Solid State Devices and Materials 2013, pp.52 - 53	-
dc.citation.title	International Conference on Solid State Devices and Materials 2013	-
dc.citation.startPage	52	-
dc.citation.endPage	53	-
dc.citation.conferencePlace	JA	-

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