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Low stress C doped WN diffusion barrier for Cu interconnection

Authors

Kim, Yong Tae; Kim, Young-Hwan

Citation

International Conference on Solid State Devices and Materials 2013, pp.52 - 53

Keywords

Cu diffusion barrier; C doped WN; ALD; Cu interconnection

URI

https://pubs.kist.re.kr/handle/201004/92861

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KIST Conference Paper > Others

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