반도체기판의 정전 열 접합 방법

Author
주병권오명환최우범이덕중
Assignee
한국과학기술연구원
Regitration Date
2000-08-03
Registration No.
270611
Application Date
1997-09-11
Application No.
97-46677
Country
KO
URI
https://pubs.kist.re.kr/handle/201004/99944
Appears in Collections:
KIST Patent > Others
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