Showing results 5 to 10 of 10
Issue Date | Title | Author(s) |
---|---|---|
- | Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging | Ju Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN |
- | High quality screen printed piezoelectric thick film fabrication for piezocantilever application | 김용범; KIM HYUNG JOON; 천채일; CHOI DOO JIN; Kim Tae Song |
- | Silicon to silicon anodic bonding using lithium doped interlayer | 정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN |
- | Silicon-to-silicon electrostatic bonding using lithia-silicate glass interlayer | 정지원; Ju Byeong Kwon; CHOI DOO JIN; OH MYUNG HWAN |
- | Tubeless packaging of field emission display using glass to glass electrostatic bonding technology | 정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN |
- | (Undefined) | 정지원; Ju Byeong Kwon; 최우범; 이덕중; CHOI DOO JIN; OH MYUNG HWAN |