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Showing results 1 to 30 of 44

Issue DateTitleAuthor(s)
2008-02-01Adhesion characteristics of copper thin film deposited on PET substrate by electron cyclotron resonance-metal organic chemical vapor depositionJeon, Bup Ju; Lee, Sangwha; Lee, Joong Kee
1996-07Characteristics of Cu thin films on a glass substrate by partially ionized beam deposition at room temperatureYoon, YS; Kim, KH; Jang, HG; Jung, HJ; Koh, SK
2024-01Copper- or Zinc-Fortified Nutrient Solution in Vertical Farming System Enriches Copper or Zinc and Elevates Phenolic Acid and Flavonoid Contents in Artemisia annua L.Son, Yang-Ju; Park, Jai-Eok; Lee, Nakhyun; Ju, Young-Woong; Pyo, Su-Hyeon; Oh, Changmin; Yoo, Gyhye; Nho, Chu Won
1996-10-30Cu films deposited by a partially ionized beam (PIE)Koh, SK; Choi, WK; Kim, KH; Jung, HJ
2017-03Direct Application of Sodium Alginate Solution via Dripping Technique for Effective Copper Removal and Recovery from Aqueous SolutionJung, Kyung-Won; Chau, Dao Minh; Choi, Brian Hyun; Ahn, Kyu-Hong
-Effects of compositional changes of Cu/ZnO, Cu/Al₂O₃ and Cu/ZnO/Al₂O₃ catalysts on metanol synthesis from CO₂ hydrogenationJoo Oh Shim; Jung Kwang Decg; HAN SUNG HAN; EOM SUNG JIN
1999-06-22Effects of Cu seeding layer on Si grown by partially ionized beam in plasma enhanced chemical vapor depositionKoh, SK; Choi, SC; Kim, KH; Jung, HJ; Choi, GJ; Yang, HS; Cho, YS
2000-08Electrodeposition of copper on porous reticular cathode (Ⅰ) - Effect of cupric ion concentration이관희; 이화영; 정원용
-Electromigration test of a new Cu/WN/MSQ/Si interconnect structureKim, Yong Tae; Kim, Young-Hwan; Kim, Seong Il
2005-03-01Electron backscattered diffraction analysis of copper damascene interconnect for ultralarge-scale integrationLee, HJ; Kim, DI; Ahn, JH; Lee, DN
2014-03Elevated serum copper and ceruloplasmin levels in Alzheimer's diseasePark, Jun-Hyun; Lee, Dong-Woo; Park, Kyung Soo
2020-07Evaluation of the Microstructure and the Electrochemical Properties of Ce(0.8(1-x))Gd(0.2(1-x))Cu(x)O([1.9(1-x)+x])Electrolytes for IT-SOFCsAccardo, Grazia; Bae, Jae Kwan; Yoon, Sung Pil
2023-01Experimental and Numerical Study of Pd/Ta and PdCu/Ta Composites for Thermocatalytic Hydrogen PermeationRyu, Seungbo; Badakhsh, Arash; Oh, Je Gyu; Ham, Hyung Chul; Sohn, Hyuntae; Yoon, Sung Pil; Choi, Sun Hee
2013-06Extraction method for manipulation of water- and organic-soluble extracts of PM2.5 in Korean winter season and its chemical compositionShin, C.-Y.; Park, H.-M.; Park, K.-S.; Lee, S.-B.; Lee, H.S.; Jung, H.; Kim, Y.-J.; Ryu, J.-C.
2021-12Fabrication and characterization of low-sheet-resistance and stable stretchable electrodes employing metal and metal nanowire hybrid structureCho, Hyunjoo; Chung, Seungjun; Jeong, Jaewook
2012-11-05Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole ArrayKim, Byoung-Joon; Cho, Yigil; Jung, Min-Suk; Shin, Hae-A-Seul; Moon, Myoung-Woon; Han, Heung Nam; Nam, Ki Tae; Joo, Young-Chang; Choi, In-Suk
2008-03-01Feasibility of micellar-enhanced ultrafiltration (MEUF) for the heavy metal removal in soil washing effluentJung, Juri; Yang, Jung-Seok; Kim, Seong-Hye; Yang, Ji-Won
-Feasibility test of heavy metal removal from washing effluent of mine soil using micellar enhanced ultrafiltration (MEUF)Juri Jung; Yang, Jung-Seok; Seong-Hye Kim; Ji-Won Yang
2020-12Immobilization of copper nanoparticles on WO(3)with enhanced catalytic activity for the synthesis of 1,2,3-triazolesAmini, Mojtaba; Hajipour, Elham; Akbari, Ali; Chae, Keun Hwa
2002-04Impurity redistributions in electroplated Cu films during self-annealingYoon, MS; PARK, YOUNG JOON; Joo, YC
-Investigation of improved adhesion between Cu films and polyimide by PSII-EIAMAD techniqueLEE, YEON HEE; Hong Ju Hi; 천혜진; HAN, SEUNG HEE
2012-04Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal AnnealingShin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon; Hwang, Sung-Hwan; Budiman, Arief Suriadi; Son, Ho-Young; Byun, Kwang-Yoo; Tamura, Nobumichi; Kunz, Martin; Kim, Dong-Ik; Joo, Young-Chang
1999-08Oxidation behavior of Ag-Cu-Ti brazing alloysLee, DB; Woo, JH; Park, SW
-Potassium (1-Organo-1H-1,2,3-triazol-4-yl)trifluoroborates from Ethynyltrifluoroborate via Regioselective One-Pot Cu-Catalyzed ReactionJeong Kyu Hyuk; KIM TAE JUNG; Song Jung Ho; Yong-Joo Kim; Ham, Jungyeob
2020-04Potential Link between Cu Surface and Selective CO2 Electroreduction: Perspective on Future Electrocatalyst DesignsTomboc, Gracita M.; Choi, Songa; Kwon, Taehyun; Hwang, Yun Jeong; Lee, Kwangyeol
2003-05Process development for the removal of copper from wastewater using ferric/limestone treatmentKang, CD; Sim, SJ; Cho, YS; Kim, WS
-Recovery of nickel and copper from ammoniacal ammonium solution by solvent extractionKim Sung Gyu; Lee Hwa Yung; Oh Jong Kee
1998-06Recycling technology of non-ferrous metals in Korea오종기
-Removal of copper from water and wastewater by ion exchange resinsS. Rengaraj; Joo, Cheol Kyun; Kim, Younghun; Cho, Young Sang; Kim, Hong Gon; Kim, Hwa Yong; Yi, Jongheop
2004-09-01Selective oxidation of CO over CuO-CeO2 catalyst: effect of calcination temperatureJung, CR; Han, J; Nam, SW; Lim, TH; Hong, SA; Lee, HI

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