| - | Effect of plasma polymerized film on fouling of heat exchangers | KIM KI HWAN; 최성창; 정형진; KOH SEOK KEUN; CHOI DOO JIN; 김철환; 하삼철 |
| - | Effects of excess oxygen on the properties of sputtered RuO₂ thin film supercapacitor | 임재홍; CHOI DOO JIN; 김한기; Cho Won Il; Yoon Young Soo |
| - | Fabrication and characterization of electrochemical capacitor using a ruthenium oxide thin film electrodes | 임재홍; CHOI DOO JIN; 김한기; 전은정; Cho Won Il; Yoon Young Soo |
| - | Fabrication and Charaterization of RuO2 based thin film supercapacitor | 임재홍; CHOI DOO JIN; 전은정; NAM SANG CHUL; Cho Won Il; Yoon Young Soo |
| - | Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging | Ju Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN |
| - | High quality screen printed piezoelectric thick film fabrication for piezocantilever application | 김용범; KIM HYUNG JOON; 천채일; CHOI DOO JIN; Kim Tae Song |
| - | Silicon to silicon anodic bonding using lithium doped interlayer | 정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN |
| - | Silicon-to-silicon electrostatic bonding using lithia-silicate glass interlayer | 정지원; Ju Byeong Kwon; CHOI DOO JIN; OH MYUNG HWAN |
| - | Tubeless packaging of field emission display using glass to glass electrostatic bonding technology | 정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN |
| - | (Undefined) | 정지원; Ju Byeong Kwon; 최우범; 이덕중; CHOI DOO JIN; OH MYUNG HWAN |
